型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1501-I/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-I/MC | MICROCHIP/微芯 | 8-VFDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-E/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-E/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-E/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-E/MC | MICROCHIP/微芯 | 8-VFDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PI6C49X0210ZHIEX | DIODES/美台 | TQFN32 | 24+ | 5888 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1501-I/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
STM32F038C6T6 | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F031K6T6 | ST/意法 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F031G6U7 | ST/意法 | 28-UFQFN | 23+ | 10000 | 2025-09-19 | |||
STM32F031G4U7 | ST/意法 | 28-UFQFN | 23+ | 10000 | 2025-09-19 | |||
STM32F031C6T7 | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030RCT6 | ST/意法 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030K6T6 | ST/意法 | 32-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5534MZQ80 | FREESCALE/飞思卡尔 | 324-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC5553MVR132 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC5553MVZ132 | FREESCALE/飞思卡尔 | 324-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC5553MZQ132 | FREESCALE/飞思卡尔 | 324-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC555LFCVR40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC555LFMZP40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC5566MZP144 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-09-19 | |||
PIC12F508-I/MC | MICROCHIP/微芯 | 8-VFDFNExposedPad | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
LMK00304SQ/NOPB | TI/德州仪器 | WQFN-32 | 24+ | 5888 | 2025-09-19 | |||
LMK00334RTVTQ1 | TI/德州仪器 | WQFN-32 | 24+ | 5888 | 2025-09-19 | |||
8T39S11ANLGI | RENESAS/瑞萨 | 48-VFQFN | 24+ | 5888 | 2025-09-19 | |||
9ZXL0853EKILFT | RENESAS/瑞萨 | VFQFPN-48 | 24+ | 5888 | 2025-09-19 | |||
NB3N2304NZDTR2G | ONSEMI/安森美 | TSSOP8 | 24+ | 5888 | 2025-09-19 | |||
CDCV304PWR | TI/德州仪器 | TSSOP8 | 24+ | 5888 | 2025-09-19 | |||
PI6C49X0210ZHIEX | DIODES/美台 | TQFN32 | 24+ | 5888 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5554MZP112 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-09-19 | |||
PIC12F1572-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC12F508-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC12F509-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-09-19 | |||
PIC12F617-I/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC12F629-I/MD | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC12F629T-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC555LFCZP40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-09-19 | |||
PIC12F1501-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-09-19 | |||
PIC12F629-I/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5554MZP80 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-09-19 | |||
PIC12F615-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5554AZP132 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-09-19 | |||
MPC555LFMVR40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F509-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC12F617-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1571-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC12F1572T-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
STM32F031C4T6TR | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030RCT6TR | ST/意法 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030R8T6TR | ST/意法 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030K6T6TR | ST/意法 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030F4P6TR | ST/意法 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
STM32F030F4P6 | ST/意法 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
STM32F030CCT6TR | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM32F030C8T6TR | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
AT91SAM7L64-CU | ATMEL/爱特梅尔 | 144-LFBGA | 23+ | 10000 | 2025-09-19 | |||
ATSAM4CP16B-AHU-Y | ATMEL/爱特梅尔 | 176-LQFP | 23+ | 10000 | 2025-09-19 | |||
ATSAM4LC4AA-AU | ATMEL/爱特梅尔 | 48-TQFP | 23+ | 10000 | 2025-09-19 | |||
ATSAM4LC2BA-MUR | ATMEL/爱特梅尔 | 64-VFQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
ATSAM4LS4BA-UUR | ATMEL/爱特梅尔 | 64-XFBGAWLCSP | 23+ | 10000 | 2025-09-19 | |||
AT91SAM7S321-MU | ATMEL/爱特梅尔 | 64-VFQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
AT91SAM7S16-MU | ATMEL/爱特梅尔 | 48-VFQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
AT91SAM7S161-AU | ATMEL/爱特梅尔 | 64-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S9S08SC4E0CTGR | NXP/恩智浦 | 16-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
S9S08QD4J1CSCR | NXP/恩智浦 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
S9S08LG32J0VLK | NXP/恩智浦 | 80-LQFP | 23+ | 10000 | 2025-09-19 | |||
S9S08DZ60F1MLC | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
S9S08DZ48F2MLH | NXP/恩智浦 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
S9S08DZ32F2MLH | NXP/恩智浦 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
S9S08AW32E5CFUE | NXP/恩智浦 | 64-QFP | 23+ | 10000 | 2025-09-19 | |||
S9KEAZN16AMLCR | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MACH211SP-10JC | LATTICE/莱迪斯 | 44-LCC(J-Lead) | 23+ | 10000 | 2025-09-19 | |||
MACHLV210-20JC | VANTIS | - | 23+ | 10000 | 2025-09-19 | |||
MACH211SP-20VC | VANTIS | - | 23+ | 10000 | 2025-09-19 | |||
MACH111-10JC | LATTICE/莱迪斯 | 44-LCC(J-Lead) | 23+ | 10000 | 2025-09-19 | |||
MACH111SP-10JC | LATTICE/莱迪斯 | 44-LCC(J-Lead) | 23+ | 10000 | 2025-09-19 | |||
MACH111-20VC | VANTIS | - | 23+ | 10000 | 2025-09-19 | |||
MACH211-20JC | VANTIS | - | 23+ | 10000 | 2025-09-19 | |||
MACH110-20JC | VANTIS | - | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MC56F8247MLH | NXP/恩智浦 | 64-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8246MLF | NXP/恩智浦 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8023VLC | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8014VFAE | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8011VFAE | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8006VWL | NXP/恩智浦 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
MC56F8006VLF | NXP/恩智浦 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8006VLC | NXP/恩智浦 | 32-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
STM8S103F2P6 | ST/意法 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
STM8S103F2P3TR | ST/意法 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
STM8S103F2P3 | ST/意法 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
STM8S103F2M6TR | ST/意法 | 20-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
STM8S103F2M6 | ST/意法 | 20-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
STM8S007C8T6TR | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM8S007C8T6 | ST/意法 | 48-LQFP | 23+ | 10000 | 2025-09-19 | |||
STM8S005K6T6CTR | ST/意法 | 32-LQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16C57C-04/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16C56-LPI/SO | MICROCHIP/微芯 | 18-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16C56A-04I/P | MICROCHIP/微芯 | 18-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC16C55A-20I/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16C54C-20/P | MICROCHIP/微芯 | 18-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC12LF1572-I/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC12LC671-04/SM | MICROCHIP/微芯 | 8-SOIC(0.2095.30mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC12CE518-04/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MC56F8356VFVE | NXP/恩智浦 | 144-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8346VFVE | NXP/恩智浦 | 144-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8345VFGE | NXP/恩智浦 | 128-LQFP | 23+ | 10000 | 2025-09-19 | |||
MC56F8025VLD | NXP/恩智浦 | 44-LQFP | 23+ | 10000 | 2025-09-19 | |||
PIC16F877-04I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-09-19 | |||
PIC16F874A-I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-09-19 | |||
PIC16F716-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16F689-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
CA4S8G16V-F9GNC | JHICC/晋华 | BGA96 | 24+ | 2000 | 2025-09-19 | |||
PIC10F200-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
PIC16LF767-I/ML | MICROCHIP/微芯 | 28-VQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC16LF73-I/ML | MICROCHIP/微芯 | 28-VQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC16LF727-I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-09-19 | |||
PIC16LF1936-I/ML | MICROCHIP/微芯 | 28-VQFNExposedPad | 23+ | 10000 | 2025-09-19 | |||
PIC16LF1934-I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-09-19 | |||
PIC16LF1907-I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-09-19 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MC9S08SH8CTJR | NXP/恩智浦 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
MC9S08SH16MTJR | NXP/恩智浦 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-09-19 | |||
MC9S08QG4CPAE | NXP/恩智浦 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-09-19 | |||
MC9S08QD4CSCR | NXP/恩智浦 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-09-19 | |||
PIC16HV785T-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16HV785T-I/SO | MICROCHIP/微芯 | 20-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16HV785-I/SO | MICROCHIP/微芯 | 20-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-09-19 | |||
PIC16HV785-I/ML | MICROCHIP/微芯 | 20-VFQFNExposedPad | 23+ | 10000 | 2025-09-19 |