型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5534MVM80 | FREESCALE/飞思卡尔 | 208-BGA | 23+ | 10000 | 2025-08-01 | |||
9ZXL0853EKILFT | RENESAS/瑞萨 | VFQFPN-48 | 24+ | 5888 | 2025-08-01 | |||
9ZXL0851EKILFT | RENESAS/瑞萨 | VFQFPN-48 | 24+ | 5888 | 2025-08-01 | |||
9QXL2001BNHGI8 | RENESAS/瑞萨 | VFQFPN-80 | 24+ | 5888 | 2025-08-01 | |||
9QXL2000BNLGI8 | RENESAS/瑞萨 | 72-VFQFN | 24+ | 5888 | 2025-08-01 | |||
8T39S11ANLGI | RENESAS/瑞萨 | 48-VFQFN | 24+ | 5888 | 2025-08-01 | |||
8T39S04ANBGI | RENESAS/瑞萨 | VFQFN32 | 24+ | 5888 | 2025-08-01 | |||
8L30110NLGI | RENESAS/瑞萨 | VQFN32 | 24+ | 5888 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1501-I/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
MPC5566MVR132 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-08-01 | |||
MPC555LFAVR40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-08-01 | |||
MPC5554MVR132 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-08-01 | |||
MPC5534MVM80 | FREESCALE/飞思卡尔 | 208-BGA | 23+ | 10000 | 2025-08-01 | |||
STM32F207ZCT6 | ST/意法 | 144-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VGT7 | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VGT6J | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F508-I/MC | MICROCHIP/微芯 | 8-VFDFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
PIC12F510-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-08-01 | |||
PIC12F519-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC12F519-I/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
PIC12F609-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC12F609-I/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
PIC12F617-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC12F635-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
LMK00304SQ/NOPB | TI/德州仪器 | WQFN-32 | 24+ | 5888 | 2025-08-01 | |||
LMK00334RTVTQ1 | TI/德州仪器 | WQFN-32 | 24+ | 5888 | 2025-08-01 | |||
PI6C49X0210ZHIEX | DIODES/美台 | TQFN32 | 24+ | 5888 | 2025-08-01 | |||
NB3N2304NZDTR2G | ONSEMI/安森美 | TSSOP8 | 24+ | 5888 | 2025-08-01 | |||
8T39S11ANLGI | RENESAS/瑞萨 | 48-VFQFN | 24+ | 5888 | 2025-08-01 | |||
9ZXL0853EKILFT | RENESAS/瑞萨 | VFQFPN-48 | 24+ | 5888 | 2025-08-01 | |||
CDCV304PWR | TI/德州仪器 | TSSOP8 | 24+ | 5888 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1572-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
PIC12F508-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
PIC12F509-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-08-01 | |||
PIC12F617-I/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
PIC12F629-I/MD | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
PIC12F629T-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
MPC5554MZP112 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1501-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-08-01 | |||
PIC12F629-I/MF | MICROCHIP/微芯 | 8-VDFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
MPC555LFCZP40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F615-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
MPC5554MZP80 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC5554AZP132 | FREESCALE/飞思卡尔 | 416-BBGA | 23+ | 10000 | 2025-08-01 | |||
MPC555LFMVR40 | FREESCALE/飞思卡尔 | 272-BBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F509-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC12F617-E/SN | MICROCHIP/微芯 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC12F1571-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC12F1572T-I/MS | MICROCHIP/微芯 | 8-TSSOP8-MSOP(0.1183 | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16C64A-04I/PQ | MICROCHIP/微芯 | 44-QFP | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04I/P | MICROCHIP/微芯 | 40-DIP(0.60015.24mm) | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04I/L | MICROCHIP/微芯 | 44-LCC(J-Lead) | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04E/PQ | MICROCHIP/微芯 | 44-QFP | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04E/P | MICROCHIP/微芯 | 40-DIP(0.60015.24mm) | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04E/L | MICROCHIP/微芯 | 44-LCC(J-Lead) | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04/PQ | MICROCHIP/微芯 | 44-QFP | 23+ | 10000 | 2025-08-01 | |||
PIC16C64A-04/P | MICROCHIP/微芯 | 40-DIP(0.60015.24mm) | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
STM32F207ZCT7TR | ST/意法 | 144-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VGT6TR | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VFT6TR | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VET6TR | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207VCT6TR | ST/意法 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
STM32F207IGH7 | ST/意法 | 201-UFBGA | 23+ | 10000 | 2025-08-01 | |||
STM32F207IGH6 | ST/意法 | 201-UFBGA | 23+ | 10000 | 2025-08-01 | |||
STM32F207IFH6TR | ST/意法 | 201-UFBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
SPC5674KFF0VMS2 | NXP/恩智浦 | 473-LFBGA | 23+ | 10000 | 2025-08-01 | |||
SPC5674FF3MVR3R | NXP/恩智浦 | 416-BBGA | 23+ | 10000 | 2025-08-01 | |||
SPC5674FF3MVR3 | NXP/恩智浦 | 416-BBGA | 23+ | 10000 | 2025-08-01 | |||
SPC5668GF1AVMG | NXP/恩智浦 | 208-BGA | 23+ | 10000 | 2025-08-01 | |||
SPC5668EF1AVMG | NXP/恩智浦 | 208-BGA | 23+ | 10000 | 2025-08-01 | |||
SPC5645CF0MLU1 | NXP/恩智浦 | 176-LQFP | 23+ | 10000 | 2025-08-01 | |||
SPC5643LF2MMM1R | NXP/恩智浦 | 257-LFBGA | 23+ | 10000 | 2025-08-01 | |||
SPC5567MVZ132 | NXP/恩智浦 | 324-BBGA | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16F18323T-I/ST | MICROCHIP/微芯 | 14-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-08-01 | |||
PIC16F15323-I/ST | MICROCHIP/微芯 | 14-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-08-01 | |||
PIC16F1455-I/SL | MICROCHIP/微芯 | 14-SOIC(0.1543.90mmW | 23+ | 10000 | 2025-08-01 | |||
MACH111-20JC | VANTIS | - | 23+ | 10000 | 2025-08-01 | |||
LCMXO2280C-3FT324I | LATTICE/莱迪斯 | 324-LBGA | 23+ | 10000 | 2025-08-01 | |||
LCMXO1200C-3FT256C | LATTICE/莱迪斯 | 256-LBGA | 23+ | 10000 | 2025-08-01 | |||
LCMXO2-7000ZE-3BG256C | LATTICE/莱迪斯 | 256-LFBGA | 23+ | 10000 | 2025-08-01 | |||
LCMXO2-1200HC-4SG32I | LATTICE/莱迪斯 | 32-UFQFNExposedPad | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MC9S12XDT256MAL | NXP/恩智浦 | 112-LQFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12XDG128MAL | NXP/恩智浦 | 112-LQFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12XD256CAA | NXP/恩智浦 | 80-QFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12XB128MAA | NXP/恩智浦 | 80-QFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12H256VFVE | NXP/恩智浦 | 144-LQFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12GC64CFUE | NXP/恩智浦 | 80-QFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12GC32MFUE | NXP/恩智浦 | 80-QFP | 23+ | 10000 | 2025-08-01 | |||
MC9S12E256VPVE | NXP/恩智浦 | 112-LQFP | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC18F24K22-I/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-08-01 | |||
PIC18F248-I/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-08-01 | |||
PIC18F23K22T-I/SS | MICROCHIP/微芯 | 28-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC18F1220-E/ML | MICROCHIP/微芯 | 28-VQFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
PIC16LF876-04I/SP | MICROCHIP/微芯 | 28-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC16LF84A-04/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16LF1936T-I/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16LF1936-I/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16F1782-I/SS | MICROCHIP/微芯 | 28-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16F1508T-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16F1503-E/MG | MICROCHIP/微芯 | 16-VFQFNExposedPad | 23+ | 10000 | 2025-08-01 | |||
PIC16C74B-20I/PQ | MICROCHIP/微芯 | 44-QFP | 23+ | 10000 | 2025-08-01 | |||
PIC16C74A/JW | MICROCHIP/微芯 | 40-CDIP(0.60015.24mm | 23+ | 10000 | 2025-08-01 | |||
PIC16C73B-20I/SP | MICROCHIP/微芯 | 28-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC16C73A-04/SO | MICROCHIP/微芯 | 28-SOIC(0.2957.50mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16C715/JW | MICROCHIP/微芯 | 18-CDIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16F877-04I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC16F874A-I/PT | MICROCHIP/微芯 | 44-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC16F716-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16F689-I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
PIC16F687-I/P | MICROCHIP/微芯 | 20-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
LC4128V-75TN144C | LATTICE/莱迪斯 | 144-LQFP | 23+ | 10000 | 2025-08-01 | |||
LC4256V-75TN100C | LATTICE/莱迪斯 | 100-LQFP | 23+ | 10000 | 2025-08-01 | |||
PIC16C63A-04I/SS | MICROCHIP/微芯 | 28-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC18F6680-E/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F6621-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F65J90-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F6525T-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F6525-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F64J11-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F6490-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 | |||
PIC18F6390-I/PT | MICROCHIP/微芯 | 64-TQFP | 23+ | 10000 | 2025-08-01 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16CE625T-04I/SS | MICROCHIP/微芯 | 20-SSOP(0.2095.30mmW | 23+ | 10000 | 2025-08-01 | |||
MC9S08SH8CTJR | NXP/恩智浦 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-08-01 | |||
MC9S08SH16MTJR | NXP/恩智浦 | 20-TSSOP(0.1734.40mm | 23+ | 10000 | 2025-08-01 | |||
MC9S08QG4CPAE | NXP/恩智浦 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
MC9S08QD4CSCR | NXP/恩智浦 | 8-SOIC(0.1543.90mmWi | 23+ | 10000 | 2025-08-01 | |||
PIC10LF322-E/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 | |||
PIC10LF320T-E/OT | MICROCHIP/微芯 | SOT-23-6 | 23+ | 10000 | 2025-08-01 | |||
PIC10F322-I/P | MICROCHIP/微芯 | 8-DIP(0.3007.62mm) | 23+ | 10000 | 2025-08-01 |